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Microelectronic Assembly with Turnkey Service and 1 to 22 Layers

Microelectronic Assembly with Turnkey Service and 1 to 22 Layers

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Model Number: Laptop Motherboard - 006

PCB assembly for OEM products .BGA minimum precision: 0.5mm .IC minimum precision: 0.4mm .Cost-effective

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Key Specifications/Special Features

  • Specifications:
    • PCB assembly for OEM products
    • BGA minimum precision: 0.5mm
    • IC minimum precision: 0.4mm
    • Cost-effective
    • EMS mark
    • Yamaha highly accurate placer production line
    • Available in various specifications
    • One-stop station EMS services provider
    • Experienced component sourcing team
    • Specially for scarce parts
    • 1 to 22-layer mixed assembly technology, specialized inassembling boards for safety, industry control and powerboards
    • SMT (Yamaha high-precise placer)
    • Plastic injection factory
    • Die-cast and sheet metal stamping factory
    • X-ray, ICT test, function and assembly line
    • Professional engineering staff to provide technicalsupports

Product Details

Primary Competitive Advantages:

  • Packaging
  • Price
  • Product Features
  • Product Performance
  • Electronic Link
  • Experienced Staff
  • Form A
  • Green Product
  • Guarantee/Warranty
  • International Approvals
  • Military Specifications
  • Prompt Delivery
  • Quality Approvals
  • Reputation
  • Service
  • Small Orders Accepted
  • Brand-name Parts
  • Country of Origin
  • Distributorships Offered

Main Export Markets:

Eastern Europe

North America

Central/South America

Asia

Western Europe

Australasia

 

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